High-Performance Skutterudite/Half-Heusler Cascaded Thermoelectric Module Using the Transient Liquid Phase Sintering Joining Technique

Thermoelectric (TE) materials have made rapid advancement in the past decade, paving the pathway toward the design of solid-state waste heat recovery systems. The next requirement in the design process is realization of full-scale multistage TE devices in the medium to high temperature range for enhanced power generation. Here, we report the design and manufacturing of full-scale skutterudite (SKD)/half-Heusler (hH) cascaded TE devices with 49-couple TE legs for each stage. The automated pick-and-place tool is employed for module fabrication providing overall high manufacturing process efficiency and repeatability. Optimized Ti/Ni/Au coating layers are developed for metallization as the diffusion barrier and electrode contact layers. The Cu−Sn transient liquid phase sintering technique is utilized for SKD and hH stages, which provides a high strength bonding and very low contact resistance. A remarkably high output power of 38.3 W with a device power density of 2.8 W·cm−2 at a temperature gradient of 513 °C is achieved. These results provide an avenue for widespread utilization of TE technology in waste heat recovery applications (Figure presented.)

This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Applied Materials & Interfaces, copyright ©, [include copyright notice from the published article] after peer review and technical editing by the publisher. To access the final edited and published work see [insert ACS Articles on Request author-directed link to Published Work, see ACS Articles on Request ].”

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Work Title High-Performance Skutterudite/Half-Heusler Cascaded Thermoelectric Module Using the Transient Liquid Phase Sintering Joining Technique
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Open Access
Creators
  1. Wenjie Li
  2. Gagan K. Goyal
  3. David Stokes
  4. Lavanya Raman
  5. Subrata Ghosh
  6. Shweta Sharma
  7. Amin Nozariasbmarz
  8. Na Liu
  9. Saurabh Singh
  10. Yu Zhang
  11. Bed Poudel
  12. Shashank Priya
License In Copyright (Rights Reserved)
Work Type Article
Publisher
  1. ACS applied materials & interfaces
Publication Date January 18, 2023
Publisher Identifier (DOI)
  1. https://doi.org/10.1021/ACSAMI.2C19137
Deposited November 18, 2024

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Version 1
published

  • Created
  • Added Manuscript_ACS_AMI_Accepted_version.pdf
  • Added Creator Wenjie Li
  • Added Creator Gagan K. Goyal
  • Added Creator David Stokes
  • Added Creator Lavanya Raman
  • Added Creator Subrata Ghosh
  • Added Creator Shweta Sharma
  • Added Creator Amin Nozariasbmarz
  • Added Creator Na Liu
  • Added Creator Saurabh Singh
  • Added Creator Yu Zhang
  • Added Creator Bed Poudel
  • Added Creator Shashank Priya
  • Published
  • Updated