Wafer-scale MOCVD TMD films used for 3D Monolithic Integration

This data package includes information on growth conditions and characterization results for TMD films used in the fabrication of 3D monolithic integrated circuits by Prof. Saptarshi Das' group at Penn State. The TMD films include MoS2 and WSe2 monolayer and bilayer films grown by metalorganic chemical vapor deposition (MOCVD) on 2" c-plane sapphire substrates in the NSF 2D Crystal Consortium facility. The data includes recipe files from the MOCVD equipment and data files from atomic force microscopy (AFM) and room temperature photoluminescence and Raman spectroscopy carried out on the samples. Characterization is typically done at the center of the 2" wafer and near the wafer edge (approximately 5 mm from wafer edge on opposite side to the flat).

Joan Redwing jmr31@psu.edu 5/3/2023

Citation

Redwing, Joan; Chen, Chen; Mc Knight, Thomas; Trainor, Nicholas; Kumari, Shalini (2023). Wafer-scale MOCVD TMD films used for 3D Monolithic Integration [Data set]. Scholarsphere. https://doi.org/10.26207/khwb-rr73

Files

  • MCV1-220823B-CC.zip

    size: 92 MB | mime_type: application/zip | date: 2023-05-08 | sha256: cc10146

  • MCV1-230123A-CC.zip

    size: 21.4 MB | mime_type: application/zip | date: 2023-05-08 | sha256: 63b1ad1

  • MCV1-230202B-NT.zip

    size: 137 MB | mime_type: application/zip | date: 2023-05-08 | sha256: 1cdfebd

  • MCV1-230214B-NT.zip

    size: 113 MB | mime_type: application/zip | date: 2023-05-08 | sha256: a3160a6

  • MCV2-230113A-TM.zip

    size: 21 MB | mime_type: application/zip | date: 2023-05-08 | sha256: 2d3224d

  • MCV2-230120B-TM.zip

    size: 19.3 MB | mime_type: application/zip | date: 2023-05-08 | sha256: ed932b2

Metadata

Work Title Wafer-scale MOCVD TMD films used for 3D Monolithic Integration
Subtitle Materials Science
Access
Open Access
Creators
  1. Joan Marie Redwing
  2. Chen Chen
  3. Thomas Virgil Mc Knight
  4. Nicholas Trainor
  5. Shalini Kumari
Keyword
  1. MOCVD
  2. MoS2
  3. WSe2
  4. Sapphire
License CC BY 4.0 (Attribution)
Work Type Dataset
Acknowledgments
  1. NSF Cooperative Agreement DMR-2039351
Publisher
  1. 2D Crystal Consortium
Publication Date May 3, 2023
Subject
  1. Materials Science
DOI doi:10.26207/khwb-rr73
Related URLs
Deposited May 08, 2023

Versions

Analytics

Collections

This resource is currently not in any collection.

Work History

Version 1
published

  • Created
  • Updated
  • Updated Acknowledgments Show Changes
    Acknowledgments
    • NSF Cooperative Agreement DMR-2039351
  • Added Creator Joan Marie Redwing
  • Added Creator Chen Chen
  • Added Creator Thomas Virgil Mc Knight
  • Added Creator Nicholas Trainor
  • Added Creator Shalini Kumari
  • Added MCV1-220823B-CC.zip
  • Added MCV1-230123A-CC.zip
  • Added MCV1-230202B-NT.zip
  • Added MCV1-230214B-NT.zip
  • Added MCV2-230113A-TM.zip
  • Added MCV2-230120B-TM.zip
  • Updated Publication Date Show Changes
    Publication Date
    • 2923-05-03
    • 2023-05-03
  • Updated Subtitle Show Changes
    Subtitle
    • Materials Science
  • Updated Subject, License Show Changes
    Subject
    • Materials Science
    License
    • https://creativecommons.org/licenses/by/4.0/
  • Published
  • Updated

Version 2
published

  • Created
  • Updated Related URLs Show Changes
    Related URLs
    • https://m4-2dcc.vmhost.psu.edu/list/data/17
    • https://m4-2dcc.vmhost.psu.edu/list/data/10.26207/khwb-rr73
  • Published
  • Updated

Version 3
published

  • Created
  • Updated Related URLs Show Changes
    Related URLs
    • https://m4-2dcc.vmhost.psu.edu/list/data/10.26207/khwb-rr73
    • http://data.2dccmip.org/10.26207/khwb-rr73
  • Published
  • Updated