Electrocaloric performance of multilayer ceramic chips: Effect of geometric structure induced internal stress

Driven by an ever-growing demand for environmentally benign cooling systems, the past decade has witnessed the booming development in the field of electrocaloric (EC) cooling technology, which is considered as a promising solid-state cooling approach. Multilayer ceramic chip capacitors (MLCCs) represent the optimum structure for EC cooling elements because of large breakdown strengths, low driving voltages, and high macroscopic volumes of active EC materials. However, fundamental relationships between the geometric parameters of MLCCs and the EC coefficient are less understood. In this study, 0.92Pb(Mg1/3Nb2/3)O3-0.08PbTiO3 (PMN–PT) MLCCs with controlled configurations, such as active/inactive layer thickness, number of layers, and active volume ratio, were fabricated, and their EC performance was evaluated. The electric properties of the MLCCs are confirmed to be closely related to the geometric structure, which influences not only the heat flow but also the internal stress, resulting in the variability of EC performance and reliability/breakdown strength. The internal stress arises due to the residual thermal stress originating from the densification-related shrinkage, thermal expansion mismatch during the sintering, and clamping stress arising from the inactive area due to the large strain from the active area under a high electric field. The geometric structure-based stress distribution and the magnitude of stress on the active layers in MLCCs were determined by finite element modeling (FEM) and correlated with the experimental EC coefficients. The results reveal that a low inactive volume percentage is beneficial toward increasing the breakdown field and enhancement of EC performance because of reduced clamping stress on active EC material.

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Work Title Electrocaloric performance of multilayer ceramic chips: Effect of geometric structure induced internal stress
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Open Access
Creators
  1. Li-Qian Cheng
  2. Yongke Yan
  3. Xiaotian Li
  4. Xiangming Xiong
  5. Xin Chen
  6. Li-Feng Zhu
  7. Wenjie Li
  8. Kai Chen
  9. Mohan Sanghadasa
  10. Shashank Priya
Keyword
  1. Electrocaloric
  2. Multilayer ceramic capacitor
  3. PMN−PT
  4. Geometric structure
  5. Internal stress
License In Copyright (Rights Reserved)
Work Type Article
Publisher
  1. ACS Applied Materials and Interfaces
Publication Date August 5, 2021
Publisher Identifier (DOI)
  1. 10.1021/acsami.1c09911
Related URLs
Deposited July 19, 2023

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Version 1
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  • Created
  • Updated
  • Added Creator Wenjie Li
  • Added Creator Liqian Cheng
  • Added Creator Yongke Yan
  • Added Creator Xiaotian Li
  • Added Creator Xiangming Xiong
  • Added Creator Xin Chen
  • Added Creator Lifeng Zhu
  • Added Creator Kai Chen
  • Added Creator Mohan Sanghadasa
  • Added Creator Shashank Priya
  • Added accepted proof.pdf
  • Updated License Show Changes
    License
    • https://rightsstatements.org/page/InC/1.0/
  • Published
  • Updated Work Title, Keyword, Publisher Show Changes
    Work Title
    • Electrocaloric performance of multilayer ceramic chips: effect of geometric structure induced internal stress
    • Electrocaloric performance of multilayer ceramic chips: Effect of geometric structure induced internal stress
    Keyword
    • electrocaloric multilayer ceramic capacitor PMN−PT geometric structure internal stress
    • Electrocaloric, Multilayer ceramic capacitor, PMN−PT, Geometric structure, Internal stress
    Publisher
    • American Chemical Society
    • ACS Applied Materials and Interfaces
  • Updated Creator Wenjie Li
  • Renamed Creator Li-Qian Cheng Show Changes
    • Liqian Cheng
    • Li-Qian Cheng
  • Updated Creator Yongke Yan
  • Updated Creator Xiaotian Li
  • Updated Creator Xiangming Xiong
  • Updated Creator Xin Chen
  • Renamed Creator Li-Feng Zhu Show Changes
    • Lifeng Zhu
    • Li-Feng Zhu
  • Updated